벽암마인텍(주) / Byuckam Mine & Technology Co., Ltd.
Byuckam Mine & Technology Co., Ltd.'s KOBDi Score is 60.29 as of Sep 2026, up 33.94 points since May 2025; it rose in 3 of the 11 monthly updates and never fell. As of Sep 2026 it is ahead of about 79% of companies in its industry, against 80% in Aug 2026 and 24% in May 2025. Its strongest position was 80% (Aug 2026) and its weakest 23% (Aug 2025).
A year earlier, in Aug 2025, its score was 26.50 and it was ahead of about 23% of companies in its industry.
| Sep 2026 | 60.29 | ahead of 79% |
| Aug 2026 | 60.29 | ahead of 80% |
| Jul 2026 | 60.29 | ahead of 79% |
| Jun 2026 | 60.13 | ahead of 79% |
| May 2026 | 60.13 | ahead of 79% |
| Apr 2026 | 60.13 | ahead of 80% |
| Mar 2026 | 60.13 | ahead of 80% |
| Feb 2026 | 60.13 | ahead of 79% |
| Dec 2025 | 60.13 | ahead of 78% |
| Aug 2025 | 26.50 | ahead of 23% |
| Jul 2025 | 26.50 | ahead of 24% |
| May 2025 | 26.34 | ahead of 24% |
| # | ||||
|---|---|---|---|---|
| 주식회사 케이씨씨글라스 영월공장 | 20–29 | #31 | ||
| 주식회사 경민 | 20–29 | #30 | ||
| 신우엠티에스 | 20–29 | #29 | ||
| 동아흥업주식회사 DONG-A HEONG-EOP MINING CO., LTD. | 10–19 | #33 | ||
| 주식회사 송 경 songgyeong co.,ltd. | 10–19 | #34 | ||
|
| ||||
|
| ||||
|
| ||||
|
| ||||
|
| ||||
|
| ||||
|
| ||||
|
| ||||
|
| ||||
|
| ||||
|
| ||||
|
| ||||
|
| ||||
|
| ||||
|
|
Where is Byuckam Mine & Technology Co., Ltd. located?
Byuckam Mine & Technology Co., Ltd. is registered at Baekjegobun-ro, Songpa-gu, Seoul, South Korea (postal code 05585).
What industry is Byuckam Mine & Technology Co., Ltd. in?
Byuckam Mine & Technology Co., Ltd. belongs to Mining & Quarrying › Industrial Minerals Mining › Limestone and clay mining.
How many employees does Byuckam Mine & Technology Co., Ltd. have?
Byuckam Mine & Technology Co., Ltd. has 30–49 employees.
What is Byuckam Mine & Technology Co., Ltd.'s KOBDi Score?
60.29 as of September 2026, ahead of about 79% of companies in its industry.
Who are Byuckam Mine & Technology Co., Ltd.'s competitors?
Similar companies include 주식회사 케이씨씨글라스 영월공장, 주식회사 경민 and 신우엠티에스.


